How to ensure uniform temperature distribution and avoid local overheating of the chip during high-temperature welding of bga chip welding tooling?
Publish Time: 2024-11-27
In the process of bga chip welding tooling, it is very important to ensure uniform temperature distribution and avoid local overheating of the chip.1. Choose the right welding equipmentUse precise temperature control equipment such as hot air guns, infrared heating plates or reflow ovens. These devices are usually equipped with multi-zone temperature control, which can monitor and adjust the heating temperature of different areas.2. Temperature curve optimizationCreating and optimizing temperature curves are key steps to ensure uniform temperature distribution. Temperature curves usually include three stages: preheating, reflow and cooling.Preheating stage: gradually increase the temperature to avoid excessive thermal stress on the chip and solder joints caused by rapid temperature increase.Reflow stage: maintain the peak temperature for an appropriate time to ensure that the solder is fully melted.Cooling stage: gradually reduce the temperature to avoid thermal stress caused by rapid cooling.3. Use convection heatingConvection heating equipment can provide more uniform heat distribution. Compared with radiation heating, convection heating transfers heat to the entire welding area more effectively through the circulation of air or other media.4. Evenly distributed heat sourceEnsure that the heat source is evenly distributed throughout the welding area. If using an infrared heating plate, ensure that the position and number of infrared lamps are reasonable to avoid heat concentration in a certain area.5. Thermal sensor and feedback systemUse multiple thermal sensors during the welding process to monitor the temperature of different areas in real time. Through the feedback system, adjust the output of the heating equipment in time to ensure that the temperature is evenly distributed.6. Welding tool designDesign a reasonable welding tool to ensure that the chip and PCB board can be evenly exposed to the heat source. The welding tool should have good thermal conductivity to help heat be evenly transferred to the chip and solder joints.7. Use a preheating platformUse a preheating platform during the preheating stage to ensure that the chip and PCB board are evenly preheated before entering the reflow oven, reducing the temperature difference during the reflow process.8. Material selectionSelect solder and solder paste with high thermal conductivity to ensure that heat can be quickly and evenly transferred to the solder joints. At the same time, select materials with matching thermal expansion coefficients to reduce thermal stress and thermal deformation.9. Process monitoring and optimizationThrough actual welding tests, monitor the temperature distribution and optimize the process parameters. Use tools such as thermal imagers to visually observe the temperature distribution during welding and promptly discover and solve problems.10. Environment and operating specificationsEnsure that the welding environment meets the standards and avoid environmental factors (such as airflow, humidity, etc.) affecting the temperature distribution. Operators should undergo professional training and perform welding in strict accordance with the operating specifications.Through the above measures, the temperature distribution during the BGA chip welding tooling welding process can be effectively ensured to be uniform, and local overheating of the chip can be avoided, thereby improving the welding quality and reliability.
